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The production process of electronic label dry inlay

2014-06-07 · Inlay refers to products made by encapsulating antennas and chips with coated paper or other materials. Inlay is also divided into dry and wet types. Dry inlay does not contain adhesive, while wet inlay has a layer of adhesive and can be used directly as finished products. So today, let's talk about the production process of electronic tag inlay.

The production process of electronic label dry inlay
Inlay refers to products made by encapsulating antennas and chips with coated paper or other materials. Inlay is also divided into dry and wet types. Dry inlay does not contain adhesive, while wet inlay has a layer of adhesive and can be used directly as finished products. So today, let's talk about the production process of electronic tag inlay.
When discussing the production process, we need to understand the components of the inlay. As mentioned earlier, the inlay is a product made by combining an antenna and a chip. The antenna material consists of 0.38Pet, 0.16, and 0.3 aluminum foil. The antenna also consists of the antenna bridge, connection points, antenna capacitors, pads, and antenna.
After understanding these points, let's start talking about our dry inlay production process.

1. Reverse encapsulation
To flip the IC into the antenna pad position, the specific method is: first apply glue, then align the IC with the pad (there are bumps on one side of the IC), and use hot pressing to fix the IC onto the pad. (IC sizes include 0.4, 0.5, 0.6, 0.8, 1.0 millimeters, etc.).

2. Release the papers
The antenna to be produced is placed on the discharge shaft, which controls tension via the expansion shaft and is controlled by the motor.

3: Dispensing area
The dispensing area can precisely locate pad points, and the dispensing glue we use is German-imported 365 and 265 glues (longitudinal conductive glues).

4: Patch area
The precision of the chip can be controlled within 0.1 millimeters, meeting all high-frequency inlay production needs. Chip deviation affects the product's pass rate, and currently, we can achieve a pass rate of about 99%.

5. Hot pressing
After placement, hot pressing begins, requiring the adhesive to cure at temperatures above 200 degrees Celsius, resulting in a complete dry inlay. This shows that 200 degrees Celsius is not difficult for IC chips.

6: Testing
After the dry inlay is produced, testing must be conducted to identify defective products and ensure the product pass rate.

7. Collect the papers
At this stage, the inlay is done. The main purpose of winding is to make inlay easier to transport and move. If you want individual sheets, that's the next step.

The link below provides a complete introduction to how electronic tags are made. The second item in this article covers what needs to be done if you want a single label.
How are RFID tags produced? RFID tag production process
http://www.zhizuoka.com/mod_article-article_content-article_id-369.html

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