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Conductive EMI Shielding Foam Adhesive

This conductive EMI shielding foam combines PU foam, conductive fabric, pressure-sensitive adhesive and release liner. It provides conductivity, EMI shielding, soft rebound, gap filling and bonding for die-cut components used in electronics, communications, automotive electronics, industrial control, cabinets and LCD assemblies.

Conductive foam, pressure-sensitive adhesive and release liner0.5 mm, 1 mm and 1.5 mm options; die cutting to drawings, samples, profile and nesting layoutGrounding, EMI shielding, signal stability, cushioning and internal bonding in electronics, automotive electronics and industrial control

Product Overview

The product uses PU foam faced with conductive fabric, supplied with pressure-sensitive adhesive and release liner. The detail images specify good conductivity and low resistance for grounding and electromagnetic-interference control. Its soft, compressible and resilient foam compensates assembly tolerances and fills gaps, making it suitable for non-precision-positioned I/O ports, LCD gaskets and structural bonding points. Standard thicknesses are 0.5 mm, 1 mm and 1.5 mm, with common sheet sizes of 100 × 100 mm and 100 × 200 mm; custom sheets, shaped die cuts and easy-tear formats are available. With wear resistance, oxidation resistance, corrosion resistance and stable bonding, it is suited to phones, computers, appliances, communications equipment, industrial computers, automotive electronics, audio equipment, toys and cabinet assemblies.

Procurement Instructions

For quotation, provide the application position, bonding material, dimensions, thickness, shape, quantity and service conditions. Drawings, samples or assembly structure can be used to confirm foam, adhesive, die-cut layout, release liner, packing and delivery.

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