Conductive EMI Shielding Foam Adhesive
This conductive EMI shielding foam combines PU foam, conductive fabric, pressure-sensitive adhesive and release liner. It provides conductivity, EMI shielding, soft rebound, gap filling and bonding for die-cut components used in electronics, communications, automotive electronics, industrial control, cabinets and LCD assemblies.

Product Overview
The product uses PU foam faced with conductive fabric, supplied with pressure-sensitive adhesive and release liner. The detail images specify good conductivity and low resistance for grounding and electromagnetic-interference control. Its soft, compressible and resilient foam compensates assembly tolerances and fills gaps, making it suitable for non-precision-positioned I/O ports, LCD gaskets and structural bonding points. Standard thicknesses are 0.5 mm, 1 mm and 1.5 mm, with common sheet sizes of 100 × 100 mm and 100 × 200 mm; custom sheets, shaped die cuts and easy-tear formats are available. With wear resistance, oxidation resistance, corrosion resistance and stable bonding, it is suited to phones, computers, appliances, communications equipment, industrial computers, automotive electronics, audio equipment, toys and cabinet assemblies.
Procurement Instructions
For quotation, provide the application position, bonding material, dimensions, thickness, shape, quantity and service conditions. Drawings, samples or assembly structure can be used to confirm foam, adhesive, die-cut layout, release liner, packing and delivery.
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