Product overview
Chip dicing protective film is used for temporary holding and surface protection during chip separation, processing and transfer. The PET base film, low-tack adhesive layer and release liner work together to stabilize the workpiece during dicing and reduce the risk of scratching, contamination and handling damage. Adhesion and dimensions can be matched to chip size, dicing process, equipment conditions and the required peel-off performance.
Product features
- Its low-tack construction allows stable removal after dicing and helps minimize impact on precision surfaces.
- The PET base film offers good flatness and dimensional stability for temporary bonding during precision processing.
- Width, length, thickness, adhesive grade and roll format can be customized; slitting is also available.
- Suitable for sample approval, volume supply and continuous processing use.
Applications
- Temporary bonding before dicing of chips, semiconductor components and precision electronic parts.
- Surface protection during dicing, handling, transfer and pre-assembly circulation.
- Precision material processing applications that require controlled residues, scratch prevention and contamination control.
Procurement notes
For quotation, please provide the chip or workpiece material, dimensions, dicing method, equipment conditions, required adhesion, temperature requirement, quantity and roll specification. Samples, drawings or details of currently used materials may also be provided so that sampling and delivery can be confirmed accurately.