MLCC Dicing and SAWING Protective Film

Product overview

MLCC dicing and SAWING protective film is also known as thermal-release film, thermal-release tape, foaming adhesive film or positioning dicing film. It consists of a PET carrier coated with a special heat-activated debonding adhesive. At room temperature, it provides stable adhesion for temporary holding of small precision workpieces during cutting, grinding, printing and assembly. Once heated to the selected release temperature, the adhesive rapidly loses tack so the workpiece can be removed easily without residue or surface contamination. The material supports automated positioning in precision electronics production, reduces labour and material loss, and improves the stability of dicing and SAWING processes.

Product features

• Stable room-temperature tack provides reliable positioning and temporary holding during precision processing.
• After processing, heat the film to the selected activation temperature for approximately 3-5 minutes. Remove the workpiece only after the adhesive has fully foamed and released; the set temperature must be reached before the product is placed into the heating process.
• Clean thermal release leaves no adhesive residue, does not contaminate the bonded surface and avoids damage to the workpiece during removal.
• PET carrier construction is available in single-sided or double-sided formats and can be supplied as film, rolls, labels or custom-cut shapes.
• Available in white, blue, green, red or grey. Width is customizable from 10 to 1040 mm, length can be supplied to order, and thickness is available from 0.1 to 0.2 mm.
• Adhesion options include low tack 200 g, medium tack 400 g and high tack 700 g to match different workpieces and process-stability requirements.
• Three release grades are available: low-temperature grade at 90-100°C for 3-5 minutes with dicing temperature not exceeding 70°C; medium-temperature grade at 120-130°C for 3-5 minutes with dicing temperature not exceeding 90°C; and high-temperature grade at 140-150°C for 3-5 minutes with dicing temperature not exceeding 120°C.
• The material is easy to cut and slit and supports multiple specifications, dimensions and custom roll widths.

Applications

• Positioning for MLCC/MLCI multilayer ceramic component dicing and processing.
• Processing and positioning of small precision surface-mount electronic components.
• Temporary holding during precision-component processing.
• Positioning of parts during circuit-board assembly.
• Positioning and printing of ring varistors and other electronic components.
• Process positioning as an alternative to conventional blue film.
• Wafer and silicon-wafer grinding and processing.
• SAWING and precision dicing operations.
• Glass cutting and LED chip cutting.
• Positioning and cutting of premium nameplates and other precision processes requiring heat-activated debonding.

Procurement notes

For quotation, please provide the workpiece material, dimensions, process method, required room-temperature positioning tack, allowable heating temperature, release grade, film thickness, width, length, single-sided or double-sided construction, quantity and roll format. If a low-, medium- or high-temperature grade is required, also state the maximum temperature reached during dicing. Existing samples, equipment conditions and removal requirements are helpful for selecting the low-tack 200 g, medium-tack 400 g or high-tack 700 g solution and arranging sample testing.