Silver Conductive Fabric Tape
Polyester conductive fabric laminated with nickel, copper or other conductive metal layers and coated with conductive pressure-sensitive adhesive. Reference thickness 0.10 mm, temperature -10 to 120°C, adhesion 1.5 kg/25 mm and elongation 7%-10%.

Product overview
Silver conductive fabric tape uses flexible polyester fabric with nickel, copper or other highly conductive metal layers and a conductive pressure-sensitive adhesive. The fabric and adhesive create a continuous electrical path. Reference values are 0.10 mm thickness, -10 to 120°C temperature resistance, 1.5 kg/25 mm adhesion and 7%-10% elongation. The material combines electrical conductivity, EMI shielding, interference and radiation control, flexibility, close wrapping, strength and aging resistance for grounding and shielding complex electronic structures.
Product features
- Conductive fabric and conductive adhesive form a continuous path for grounding and EMI shielding.
- Provides electromagnetic-interference and radio-frequency shielding for local electronic protection.
- Flexible, strong polyester fabric wraps curved surfaces, cables and irregular seams.
- Strong conductive adhesive maintains close and stable contact after application.
- Reference values: 0.10 mm, -10 to 120°C, 1.5 kg/25 mm adhesion and 7%-10% elongation.
- Available in custom lengths, widths, slit rolls and die-cut shapes with useful aging resistance.
Applications
- EMI shielding at electronic enclosures, displays, communications equipment and module seams.
- Conductive wrapping, grounding and interference control for cables and flexible circuits.
- Electrical connection between metal housings, plated plastics and conductive foam.
- Flexible wrapping and die-cut shielding for localized radiation-control areas.
Procurement notes
Provide width, length, thickness, target resistance or shielding requirement, substrate, service temperature, quantity and slitting or die-cutting needs. Overlap area, oxidation, lamination pressure and grounding design affect performance. Test contact resistance, shielding attenuation, adhesion and temperature resistance on the actual device structure before mass use.
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