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Silver Conductive Fabric Tape

Polyester conductive fabric laminated with nickel, copper or other conductive metal layers and coated with conductive pressure-sensitive adhesive. Reference thickness 0.10 mm, temperature -10 to 120°C, adhesion 1.5 kg/25 mm and elongation 7%-10%.

Polyester conductive fabric, nickel/copper conductive layer and conductive pressure-sensitive adhesiveReference 0.10 mm thick, -10 to 120°C, adhesion about 1.5 kg/25 mm, elongation 7%-10%; custom sizesElectronic grounding, EMI shielding, cable wrapping, enclosure seams, displays and communications equipment

Product overview

Silver conductive fabric tape uses flexible polyester fabric with nickel, copper or other highly conductive metal layers and a conductive pressure-sensitive adhesive. The fabric and adhesive create a continuous electrical path. Reference values are 0.10 mm thickness, -10 to 120°C temperature resistance, 1.5 kg/25 mm adhesion and 7%-10% elongation. The material combines electrical conductivity, EMI shielding, interference and radiation control, flexibility, close wrapping, strength and aging resistance for grounding and shielding complex electronic structures.

Product features

  • Conductive fabric and conductive adhesive form a continuous path for grounding and EMI shielding.
  • Provides electromagnetic-interference and radio-frequency shielding for local electronic protection.
  • Flexible, strong polyester fabric wraps curved surfaces, cables and irregular seams.
  • Strong conductive adhesive maintains close and stable contact after application.
  • Reference values: 0.10 mm, -10 to 120°C, 1.5 kg/25 mm adhesion and 7%-10% elongation.
  • Available in custom lengths, widths, slit rolls and die-cut shapes with useful aging resistance.

Applications

  • EMI shielding at electronic enclosures, displays, communications equipment and module seams.
  • Conductive wrapping, grounding and interference control for cables and flexible circuits.
  • Electrical connection between metal housings, plated plastics and conductive foam.
  • Flexible wrapping and die-cut shielding for localized radiation-control areas.

Procurement notes

Provide width, length, thickness, target resistance or shielding requirement, substrate, service temperature, quantity and slitting or die-cutting needs. Overlap area, oxidation, lamination pressure and grounding design affect performance. Test contact resistance, shielding attenuation, adhesion and temperature resistance on the actual device structure before mass use.

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Phone/WeChat: 18666911248
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