ESD Antistatic Polyimide Masking Tape

Product overview

ESD antistatic polyimide masking tape uses polyimide film coated with heat-resistant silicone pressure-sensitive adhesive and an antistatic surface treatment. The amber tape provides reference resistance of about 260°C continuous and 300°C short term, surface resistance of 10^6-10^9 ohms and peel static voltage below 100 V. It also offers low- and high-temperature resistance, radiation and solvent resistance, strong adhesion, conformability and clean removal for high-temperature masking, PCB gold-finger protection and low-static electronic assembly.

Product features

• Polyimide film provides heat resistance, insulation and dimensional stability for high-temperature electronics processing.
• Reference resistance is about 260°C continuous and 300°C short term for SMT reflow and wave-solder operations.
• Antistatic surface treatment provides reference surface resistance of 10^6-10^9 ohms to control charge accumulation.
• Peel static voltage below 100 V suits components and surface-mount processes sensitive to removal charge.
• Silicone pressure-sensitive adhesive bonds strongly and conformably to gold fingers, PCBs and curved areas.
• Chemical-solvent, corrosion and radiation resistance support stable use in demanding processing environments.
• Good toughness, abrasion and tear resistance reduce breakage during application and removal.
• Removes with little adhesive residue and can be slit to width for continuous rolls and production stations.

Applications

• Gold-finger masking and protection during PCB SMT reflow, wave soldering and hot-air solder leveling.
• High-temperature fixing and protection for electronic components, sensitive devices and low-static SMT processes.
• Heat-resistant insulation, binding and temporary positioning of appliances, motors, coils and cables.
• Masking and identification in laboratories, electronics production and repair stations requiring low peel static.

Procurement notes

State width, length, total thickness, continuous and peak temperature, surface-resistance and peel-static targets, process, quantity and packaging. For SMT, wave soldering or hot-air solder leveling, state peak temperature, exposure time, surface and removal timing. Test heat resistance, ESD performance, adhesion, residue and edge lift on the actual PCB before volume purchasing.