도금 및 주석 분사 보호 테이프

제품 개요

This tape protects selected areas before electroplating, tin spraying, coating, chemical treatment, and high-temperature processing. It helps keep specified areas clean and reduces contamination, over-plating, unwanted tin coverage, or surface-treatment errors.

제품 특징

• Suitable for masking protection during electroplating, tin spraying, coating, and hardware surface treatment.
• The adhesive layer bonds steadily and works on flat surfaces, edges, and locally complex areas.
• Heat resistance, width, length, and packaging can be matched to the customer's process.
• Easy to remove, suitable for fast application and cleanup in batch processing.
• Can be combined with slitting, rewinding, or die cutting to improve on-site efficiency.

적용 범위

• Masks areas that should not receive plating during electroplating.
• Tin-spraying protection for PCBs, hardware parts, terminals, metal sheets, and electronic parts.
• Protection for coating, baking paint, surface treatment, and industrial packaging.

조달 지침

For quotation, please provide tape material, thickness, width, length, quantity, heat-resistance requirement, application surface, and usage scenario. If slitting, rewinding, die cutting, or special packaging is needed, include those details so we can confirm the material specification and delivery method.